This comes in a two part dual syringe mixture for electronically insulating epoxy that combines moderate curing rate and high thermal conductivity.
Minimum quantity for "8329TCM-6ML Medium Cure Thermal Conductive Adhesive" is 6.
This is a mixture of two syringes of combined 15 grams of silver high conductivity epoxy with a quick drying and working time in 4 hours. The 8331S epoxy has many uses in the production, repair and assembly of electronics in microelectronics and optoelectronics.
Clear sprays protect dry transfers on absorbent surfaces such as paper. 12 oz.
Solder Tip Tinner is a mixture of solder powder and thermally stable, oxide-reducing compounds. 96.5% Tin / 3.0% Silver / 0.5% Copper.
A white, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. RTV 11 SILICONE, TWO PART (RATIO 200:1), WHITE, FLOWABLE FOR POTTING HIGH VOLTAGE APPLICATIONS, SS4155-P PRIMER REQUIRED.
A clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. RTV 12A SILICONE, TWO-PART (RATIO 20:1), CLEAR, LOW VISCOSITY, NO PRIMER REQUIRED, RTV12C CURING AGENT REQUIRED. Will cure in deep sections. The excellent electrical properties make it a candidate material for both high and low voltage electrical assemblies. Cushions against mechanical shock and vibration. The product comes complete with catalyst DBT.
