8329TCS-6ML Slow Cure Thermal Conductive Adhesive

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The 8329TCS-6ML Slow Cure Thermal Conductive Adhesive comes in a two part dual syringe mixture for electronically insulating epoxy that combines long working time and high conductivity with ease of use.

It has a convenient 1-to-1 mix ratio and 4 hours pot life.

Due to this long pot life, the mixed adhesive essentially behaves like a 1-part adhesive for the duration of a work shift.

However, unlike 1-part adhesives, it doesn’t require temperatures as high as 130 and 170 °C, and it will cure at a more moderate 80 °C in less than 1 hour.

The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks.

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