Low Temperature Lead Free Solder Paste-M Syringe
Applications & Usages
The solder paste is designed to be used for heat sinks, LEDs, and telecommunication assemblies.
Thermal Properties Value
Melting Point, Solidus 138 °C [280 °F]
Melting Point, Liquidus 138 °C [280 °F]
Tip Temperature Upper Limit: Do not exceed 425 °C [800 °F]
Storage and Shelf Life
Store refrigerated between 2–10 °C [35–50 °F] to minimize solvent evaporation, flux separation, and chemical activity.
Store syringes in an upright position with tip down to prevent flux separation and air entrapment.
Bring the paste to room temperature prior to use. To warm the refrigerated paste, let the unopened container stand for 4 hours at ambient temperature before use. For faster warm up, place the sealed container in a water bath at ambient temperature for 30 minutes.
Shelf Life
Unopened Container stored at 2–10 °C [35–50 °F]: 6 months from date of manufacture.
WARNING
