XKB2-Z7T-WZM DIGI XBEE ZIGBEE Module Development Kit
Embedded Zigbee modules provide OEMs with a simple way to integrate mesh technology into their application
Digi XBee® and Digi XBee-PRO Zigbee RF modules provide cost-effective wireless connectivity to electronic devices. They are interoperable with other Zigbee PRO feature set devices, including devices from other vendors*. Digi Zigbee Development Kits are the perfect way to begin Zigbee application development.
Digi XBee and Digi XBee PRO Zigbee modules are ideal for applications in the energy and controls markets where manufacturing efficiencies are critical. The Serial Peripheral Interface (SPI) provides a high-speed interface and optimizes integration with embedded microcontrollers, lowering development costs and reducing time to market.
Products in the Digi XBee family require little to no configuration or additional development. Programmable versions of the Digi XBee Zigbee module make customizing applications easy. Programming directly on the module eliminates the need for a separate processor. Because the wireless software is isolated, applications can be developed with no risk to RF performance or security.
Digi’s Zigbee compatible module is based on the Ember EM35x (EM357 and EM3587) system on chip (SoC) radio ICs from Silicon Labs, utilizing 32-bit ARM® Cortex® M3 processor.
*Interoperability requires the Zigbee feature set to be deployed on all devices. Contact Digi Support for details.
Specifications:
TRANSCEIVER CHIPSET: Silicon Labs EM357 SoC
DATA RATE: RF 250 Kbps, serial up to 1 Mbps
INDOOR/URBAN RANGE*: Up to 60 m (200 ft)
OUTDOOR/RF LINE-OF-SIGHT RANGE*: Up to 1200 m (4000 ft)
TRANSMIT POWER: 3.1 mW (+5 dBm) / 6.3 mW (+8 dBm) boost mode
RECEIVER SENSITIVITY: (1% PER) -100 dBm / -102 dBm boost mode.
FEATURES
SERIAL DATA INTERFACE UART, SPI
CONFIGURATION METHOD API or AT commands, local or over-the-air (OTA)
FREQUENCY BAND ISM 2.4 GHz
FORM FACTOR Through-hole, surface mount
INTERFERENCE IMMUNITY DSSS (Direct Sequence Spread Spectrum)
ADC INPUTS (4) 10-bit ADC inputs
DIGITAL I/O 15
ANTENNA OPTIONS Through-hole: PCB antenna, U.FL connector, RPSMA connector, or integrated wire.
SMT: RF pad, PCB antenna, or U.FL connector
OPERATING TEMPERATURE -40º C to 85º C (-40º F to 185º CF)
DIMENSIONS (L X W X H) AND WEIGHT:
Through-hole: 2.438 x 2.761 cm (0.960 x 1.087 in)
SMT: 2.199 x 3.4 x 0.305 cm (0.866 x 1.33 x 0.120 in)
POWER REQUIREMENTS
SUPPLY VOLTAGE 2.1 to 3.6 V
TRANSMIT CURRENT: 33 mA @ 3.3 VDC /45 mA boost mode
47 mA @ 3.3 VDC /59 mA boost mode
RECEIVE CURRENT: 28 mA @ 3.3 VDC / 31 mA boost mode
42 mA @ 3.3 VDC / 45 mA boost mode
POWER-DOWN CURRENT: <1 μA @ 25º C (77º F) 1.5 μA @ 25º C (77º F)
WARNING
