860-150G MG Chemicals 150 Gram Silicone Heat Transfer Compound

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The 860-150G MG Silicone Heat Transfer Compound is designed for use in transferring heat away from electrical and electronic devices.

Devices Transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. 

  • High thermal conductivity
  • High dielectric constant
  • High dissipation factor
  • Use with heat sinks or metal chassis
  • Will not dry or harden
  • Contains zincs oxides and polydimenthyl siloxane
  • Non-silicone version available



Physical Properties Test Method Non Silicone
Appearance Visual Off white / smooth paste White paste
Consistency ASTM D 217 310-320  
Specific Gravity
@ 25°C (77°F)
  2.5 min 2.3 min
Bleed %
24 hours @ 200°C
FTM-321 1.0% max 2.0% max
24 hours @ 200°C
FTM-321 2.0% max 2.0% max
Dropping Point ASTM D-566 > 500°F (260°C) > 500°F (260°C)
Min. operating temp.   -40°F/-40°F 55°F/48°C
Max. operating temp.   200°C 200°C (consistent) 
300°C (intermittent)
Electrical Properties Test Method Non Silicone
Thermal Conductivity Hot Wire Method Heat Flow #36 °C 0.773 W/m•K 0.657 W/m•K
Dielectric Strength
(0.05l gap)
ASTM D-149 350 V/MIL 400 V/MIL
Dielectric Constant @ 1000 Hz ASTM D- 150 4.4 3.81
Dissipation Factor
@ 1000 Hz
ASTM D 150 0.0021 0.0032
Resistivity @ 21°C ASTM D 150 6.38 x 1013Ohm•cm 1.5 x 1015 Ohm•cm


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