High-performance thermal adhesive tape designed for efficient heat dissipation in electronic components.
Key Features:
- High Thermal Conductivity: ASTM D5470 standards with a thermal conductivity rating of 1.5W/m.K.
- Strong Adhesion: Adhesion strength of 1.3kg/inch.
- Durable & Flexible: Made from a combination of fiberglass and conductive ceramic powder, this tape is designed to fill gaps on uneven surfaces for a tight fit.
- Heat Resistant: Can withstand long-term temperatures of up to 120°C and short-term exposure up to 180°C.
- Easy to Apply: Simply cut to size, clean the surface, apply, and remove the blue backing film. The tape is repositionable without damaging components.
Applications:
- Mounting heat sinks on CPUs, GPUs, and other IC chips.
- Securing LED strips and high-power LEDs.
- Bonding video card RAM and DDR memory modules.
- Replacing screws in sensitive electronic components to enhance work efficiency.
Specifications:
- Thickness: 0.2mm
- Width: 20mm
- Length: 25M per roll
- Thermal Conductivity: 1.5W/m.K
- Breakdown Voltage: 4KV
- Adhesion Strength: 1.3kg/inch
- Long-Term Heat Resistance: 120°C
- Short-Term Heat Resistance: 180°C
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