When ICs heat up, it can lead to a big problem. Help dissipate the heat with a heat sink or heat sink compounds. Features: Made of black, anodized aluminum. Fits TO-3 packages. Number of holes: 4. Size: 1.83"L x 1.40"W x 1.25"H (46.5mm L x 35.6mm W x 31.8mm H).
When ICs heat up, it can lead to a big problem. Help dissipate the heat with a heat sink or heat sink compounds. Features: Made of black, anodized aluminum. Fits TO-3 packages. Number of holes: 4. Size: 1.90"L x 1.40"W x 0.50"H (48.3mm L x 35.6mm W x 12.7mm H).
When ICs heat up, it can lead to a big problem. Help dissipate the heat with a heat sink or heat sink compounds. Features: Made of black, anodized aluminum. Fits TO-220 packages. Number of holes: 3. Size: 1.38"L x 0.50"W x 1.50"H (35.05mm L x 12.7mm W x 38.1mm H).
When ICs heat up, it can lead to a big problem. Help dissipate the heat with a heat sink or heat sink compounds. Features: Made of black, anodized aluminum. Fits TO-220 packages. Number of holes: 1. Size: 2.52"L x 1.65"W x 1.00"H (64.0mm L x 41.9mm W x 25.4mm H).
Features: Made of black, anodized aluminum. Fits TO-220 packages. Number of holes: 1. Size: 0.52"L x 0.36"W x 0.75"H (13.21mm L x 9.14mm W x 19.05mm H).
When ICs heat up, it can lead to a big problem. Help dissipate the heat with a heat sink or heat sink compounds. Features: Made of black, anodized aluminum. Fits TO-220 packages. Number of holes: 1. Size: 0.75"L x 0.38"W x 0.75"H (19.05mm L x 9.65mm W x 19.05mm H).
Features: Type: TO-220. Holes: 0. Size:1.18 x 1.0 x 0.5 ( L" x W" x H" ) (30mm x 25.4mm x 12.7mm).
