SMD291AX50T3 Solder Paste in jar 50g (T3) Sn63/Pb37 no clean

SMD291AX50T3 Solder Paste in jar 50g (T3) Sn63/Pb37 no clean

Metal Content: 90.25% metal by weight.
Particle Size: T3 (25-45 microns)
Size: 50g jar

Shelf Life
Chip Quik® products use synthetic no clean flux, providing exceptional shelf life compared to natural rosin fluxes.
Flux: refrigerated >24 months, unrefrigerated >24 months
SnPb Solder Paste: refrigerated >12 months, unrefrigerated >6 months
SnBi Solder Paste: refrigerated >12 months, unrefrigerated >6 months
SAC305 Solder Paste: refrigerated >12 months, unrefrigerated >6 months

Stencil Life
>8 hours @ 20-50% RH 22-28C (72-82F)
~4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Refrigerate at 3-8C (37-46F). Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

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