M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder.
96.3% tin, 0.7% copper and 3% silver
These alloys conform to the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would use normal solder.
Features / Benefits:
- Lead free
- Complies with RoHS
- Exceeds the impurity requirements of J-Std-006C
- No Clean flux
- 21 Gauge, 0.032" diameters
- Excellent wettability
- Hard non-conductive residues
- 1 lb of lead free solder has 27% more length than leaded solder
M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is 2.0-4.0%.
A unique flux system was specifically used for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator that wets and spreads like an RA type. This special activator exhibits virtually no spattering. Activator conforms to J-STD-004, REL0.Cleaning Flux core is a no clean formulation therefore the residues do not need to be removed for typical applications. If residue removal is desired, please visit the following link for a list of Flux Removers: http://www.mgchemicals.com/products/solder/flux-removers/
Other Available Sizes:
|Catalog Number||Sizes Available||Description|
|4900-35G||17 g (0.6 oz) x 25||Pocket pack|
|4900-112G||1/4 lb (113 g)||Spool|
|4900-227G||1/2 lb (227 g)||Spool|
|4900-454G||1 lb (454 g)||Spool|