M.G. Chemicals No Clean Leaded Solder Paste - 63% tin, 37% lead. Dispenser: 35g syringe.
The 4860P – Sn63/Pb37 solder paste, also known as Sn63 solder paste or 63 37 solder paste, is a no clean solder paste that is made from a blend of high purity, non-recycled tin and lead alloy powder combined with a no-clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post-soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. (“No-clean” means that residues are not harmful to assemblies.)
Sn63/pb37 solder paste is designed for use in high-speed printing and is an ideal choice for SMT SOLDER PASTE PRINTERS. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.
Features & Benefits
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Non-corrosive
- Non-conductive residue
- Halide free
- Good wettability
- Type 3 (45-25 µm)
WARNING
