4860P-35G MG No Clean Leaded Solder Paste - 63% tin, 37% lead , 35 gram Syringe

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M.G. Chemicals No Clean Leaded Solder Paste - 63% tin, 37% lead. Dispenser: 35g syringe.

The 4860P – Sn63/Pb37 solder paste, also known as Sn63 solder paste or 63 37 solder paste, is a no clean solder paste that is made from a blend of high purity, non-recycled tin and lead alloy powder combined with a no-clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post-soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. (“No-clean” means that residues are not harmful to assemblies.)

Sn63/pb37 solder paste is designed for use in high-speed printing and is an ideal choice for SMT SOLDER PASTE PRINTERS. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.

Features & Benefits

  • Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  • Flux meets J-STD-004B
  • Non-corrosive
  • Non-conductive residue
  • Halide free
  • Good wettability
  • Type 3 (45-25 µm)
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