The 860-60G MG Silicone Heat Transfer Compound is designed for use in transferring heat away from electrical and electronic devices.
Devices Transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.
- High thermal conductivity
- High dielectric constant
- High dissipation factor
- Use with heat sinks or metal chassis
- Will not dry or harden
- Contains zincs oxides and polydimenthyl siloxane
- Non-silicone version available
| Physical Properties |
Test Method |
Non Silicone
8610 |
Silicone
860 |
| Appearance |
Visual |
Off white / smooth paste |
White paste |
| Consistency |
ASTM D 217 |
310-320 |
|
Specific Gravity
@ 25°C (77°F) |
|
2.5 min |
2.3 min |
Bleed %
24 hours @ 200°C |
FTM-321 |
1.0% max |
2.0% max |
Evaporation
24 hours @ 200°C |
FTM-321 |
2.0% max |
2.0% max |
| Dropping Point |
ASTM D-566 |
> 500°F (260°C) |
> 500°F (260°C) |
| Min. operating temp. |
|
-40°F/-40°F |
55°F/48°C |
| Max. operating temp. |
|
200°C |
200°C (consistent)
300°C (intermittent) |
| Electrical Properties |
Test Method |
Non Silicone
8610 |
Silicone
860 |
| Thermal Conductivity |
Hot Wire Method Heat Flow #36 °C |
0.773 W/m•K |
0.657 W/m•K |
Dielectric Strength
(0.05l gap) |
ASTM D-149 |
350 V/MIL |
400 V/MIL |
| Dielectric Constant @ 1000 Hz |
ASTM D- 150 |
4.4 |
3.81 |
Dissipation Factor
@ 1000 Hz |
ASTM D 150 |
0.0021 |
0.0032 |
| Resistivity @ 21°C |
ASTM D 150 |
6.38 x 1013Ohm•cm |
1.5 x 1015 Ohm•cm
|
|
WARNING
