The 832HT High Temperature Epoxy Encapsulating and Potting Compound is for encapsulating and potting electronics in high temperature environments, aggressive chemical environments.
Bonds to a wide variety of substrates, including metals, glass, ceramics and many plastics.
Features / Benefits:
- Extreme physical strength and chemical resistance
- Suitable for extreme environments, such as submersion in salt water, acids, bases, fuels, and alcohols
- Protects against strong vibrations, abrasions, and direct physical impact
- Extremely difficult to remove - grants incredible technology protection
- Maximum service temperature of 275°C (527°F)
Typical Applications:
- Use in electronic assemblies to prevent vibration damage
- Encapsulate circuits for the purpose of technological protection
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