8329TCM-200ML Medium Cure Thermal Conductive Adhesive

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The 8329TCM Medium Cure Thermal Conductive Adhesive comes in a two part dual syringe mixture for electronically insulating epoxy that combines moderate curing rate and high thermal conductivity.

 It has a convenient 1-to-1 ratio, a workable 45 minutes pot life, and a moderate curing rate.

It may achieve a minimal service cure in seven hours at room temperature.

The cured adhesive bonds very well to most substrates used in electronic assemblies; and resists thermal and mechanical shocks. 

  • Excellent 1.36 W/(m•K) thermal conductivity
  • Easy 1:1 mix ratio
  • Adheres to most electronic substrates
  • Stores and ships at slightly below room temperature — no freezing or dry ice required
  • Very long shelf life of at least two years — even when stored at room temperature
  • Strong water and chemical resistance to brine, acids, bases, and aliphatic hydrocarbons
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