One-part Black Epoxy Thermally Conductive Adhesive 10ML. High TG: Glass Transition Temperature
Applications & Usages:
The 9460-10ML is a black thermally conductive epoxy adhesive designed for semi-conductor flip chip packaging, hybrid micro-electronic substrate attachment, and lid-sealing in electronic assembly operations. It can also be used in manual, pneumatic, and robotic dispensing processes.
Features:
ATTENTION! This product must be heat cured.
- One-part adhesive - no mixing required prior to use
- High thermal conductivity
- Electrically insulative
- Thixotropic and non-sagging
- Minimum cure temperature of 100 °C [212 °F]
- Tg: 117 °C
WARNING
