Dual Syringe Epoxy Structural Adhesive for Electronics 25 ML from MG Chemicals. 9201 is a 2-component epoxy structural epoxy adhesive that forms bonds capable of withstanding heavy shocks. The adhesive has high impact resistance and high strength, helping replace a wide range of mechanical techniques like welding. By avoiding joining parts with metal fasteners, the glue can help lightweight modular devices during assembly.
The 9201 epoxy structural adhesive bonds strongly to a variety of surfaces like metals, glass, composite and most plastics. The glue also bonds many engineered thermoplastics such as sheet molded compounds and glass reinforced plastics. The epoxy is useful for bonding dissimilar materials and cures at room temperature
This adhesive works best on metal substrates like aluminum or steel. The cured epoxy has enough strength to bond entire panels, ideal for improving process efficiency in auto assembly. It bonds well to other substrates like wood for jobs where rigid joints are ideal. The epoxy is paste-like, making it easy to localize at the bond joint.
After the curing process, the epoxy is hard and rigid. These features make the 9201 ideal for not only high impact jobs but also where there is a need for load-bearing. The high compressive strength means the epoxy withstands exposure to high pressures with little give or deformation.
The cured epoxy is highly crosslinked and has great chemical resistance, meaning it can survive harsh climates. It protects against common elements like moisture, dust and fungus also. These features separate epoxy from other types of structural adhesives which degrade under similar exposure. With a 60-minute working time, users have enough time after mixing to properly apply the glue.
The 9201 bonds to a wide variety of substrates with minimal surface preparation. For many surfaces, light sanding is enough; however, some plastics can be difficult and require advanced techniques. For these surfaces, consider plasma, corona or flame treatment to get a strong bond. Using risky etching solutions in most instances is unnecessary.
The high performance epoxy is non-conductive and structurally bonds components on PCBs. Specifically, the glue is ideal for bonding chips or even as a staking compound. The paste consistency makes it an ideal gap filler as well. The handy cartridge package makes application simple, removing common errors like improper measuring or mixing.
Attributes:
- 1:1 mix ratio
- Excellent bond strength to a wide array of substrates
- Non-sag consistency
- High tensile and compressive strength
- Excellent chemical resistance
- Net Weight: 32.7g
- Net Volume: 25ml
