MEDIUM CURE THERMALLY CONDUCTIVE ADHESIVE, FLOWABLE
8329TFM is a thermally conductive two-part epoxy adhesive. It is dark grey, smooth, thixotropic, and bonds well to a wide variety of substrates.
This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips, and automatic dispensing systems.
For a faster working life, use 8329TFF. For a longer working life, use 8329TFS.
|Features and Benefits
- Thermal conductivity of 1.1 W/(m·K)
- 1:1 mix ratio
- Working life: 45 minutes
- Cure time: 24 hours at room temperature or 2.5 hours at 65 °C (149 °F)
- Provides strong electrical insulation
- High tensile
- Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
- Shelf life: ≥3 years
- RoHS 3 compliant