3D Printer Heated Bed Controller MOSFET Module
High quality large heat sink ensures a better heat dissipation. The module can solve the current load problem when the heated bed power is too large. Under the normal heat dissipation, the module can be stable long-term when measured I (Max) = 30A. When using the module, the current should not exceed 30A.
Can be used for 12V to 50VDC systems.
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