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8329TFM-25ML MEDIUM CURE THERMALLY CONDUCTIVE ADHESIVE, FLOWABLE
US$39.95
8329TFM is a thermally conductive two-part epoxy adhesive. It is dark grey, smooth, thixotropic, and bonds well to a wide variety of substrates.
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8329TFF-50ML FAST CURE THERMALLY CONDUCTIVE ADHESIVE, FLOWABLE
US$61.99
8329TFF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, thixotropic, and bonds well to a wide variety of substances.
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8329TFF-25ML FAST CURE THERMALLY CONDUCTIVE ADHESIVE, FLOWABLE
US$39.99
8329TFF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, thixotropic, and bonds well to a wide variety of substances.
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PLA17BK1 MG Chemicals Black PLA 3D Printer Filament, 1.75, 1 kg Spool
US$33.62
MG Chemicals PLA Premium 3D printing filaments are manufactured under very strict quality controls to ensure consistant quality and a tight diameter tolerance accuracy.
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PETG17WH1 MG Chemicals White PETG 3D Printer Filament, 1.75, 1 kg Spool
US$33.62
MG Chemicals PETG 3D printer filaments are manufactured under very strict quality controls to ensure consistant quality and a tight diameter tolerance accuracy.
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ABS17BL1 MG Chemicals Blue ABS 3D printer Filament, 1.75 , 1KG Spool
US$29.95
MG Chemicals Acrylonitrile butadiene styrene (ABS) 3D printer filaments are made of high purity Acrylonitrile butadiene styrene pellets with a tight diameter tolerance.
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832WC-375MLCA WATER CLEAR EPOXY 2 BOTTLE KIT
US$74.65
832WC potting and encapsulating compound is a general purpose, water-clear, hard, two-part water clear epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies.  This product is designed for applications where high clarity is required. It does not yellow when exposed to UV light or elevated temperatures; it maintains clarity in applications with service temperatures up to 65 °C (149 °F) and intermittent exposures up to 100 °C (212 °F). It also provides excellent electrical insulation and protects circuit board and other electronic devices from static discharges, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.  This epoxy has a convenient 2:1 volume mix ratio, making it compatible with most dispensing equipment. 832WC can be cured at room temperature or higher.
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832FX-450ML Flexible Encapsulation Potting Compound Black Epoxy, 2 bottle kit
US$69.95
832FX potting and encapsulating compound is a flexible, black, two-part epoxy that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where minimizing the physical stress on components is critical. It is also good in low temperature and arctic environments, as well as applications that involve temperature cycling or rapid temperature changes. It provides the functionality of silicone, but with the durability and cost- effectiveness of epoxy. Due to its very low mixed viscosity, it can easily penetrate small gaps and cavities. It also provides excellent electrical insulation and protects components from static discharges, vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals. This epoxy has a convenient 1:1 volume mix ratio, making it compatible with most dispensing equipment. 832FX can be cured at room temperature or higher.
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9300-10ML One-part Amber Epoxy Thermally Conductive Adhesive 10ML. Low Tg: Glass Transition Temperature
US$15.39
The 9300-10ML is an amber color thermally conductive epoxy adhesive designed for low stress bonding of SMD’s and fiber optic components. It may be used for bonding passive components to a PCB, such as motors, connectors, coils, or ferrites or to reinforce wire bonds, or to stake SMD’s to a PCB for extra support. It can also be used in manual, pneumatic, and robotic dispensing processes.
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9460-10ML One-part Black Epoxy Thermally Conductive Adhesive 10ML. High TG: Glass Transition Temperature
US$37.30
The 9460-10ML is a black thermally conductive epoxy adhesive designed for semi-conductor flip chip packaging, hybrid micro-electronic substrate attachment, and lid-sealing in electronic assembly operations. It can also be used in manual, pneumatic, and robotic dispensing processes.
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PETG17BK1 1KG 1.75mm Black PETG Filament for 3D Printers
US$33.62
This is a 1.75mm diameter black PETG filament with a density of 1.25 g/cm^3. It has a net weight is 1000g (around 1300g gross). The material of the filament will melt with nozzle temperatures ranging from 220-245°C.
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4902P-15G Low Temperature Lead Free Solder Paste T3 Syringe
US$19.75
The 4902P Sn42/Bi57/Ag1 Low Temperature Solder Paste syringe T3 is made for low temperature applications. It spreads and adheres well to a variety of materials and provides excellent soldering results and appearance. Contains 15 g (0.52 oz).
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4140A-P Flux remover Pen 11.5 mL (0.38 oz.)
US$13.95
Safe on most plastics. Moderate dry time. Zero residue.
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4902P-25G Low Temperature Lead Free Solder Paste-M Syringe
US$28.95
The solder paste is designed to be used for heat sinks, LEDs, and telecommunication assemblies. Thermal Properties Value; Melting Point, Solidus 138 °C [280 °F]. Melting Point, Liquidus 138 °C [280 °F]. Tip Temperature Upper Limit: Do not exceed 425 °C [800 °F].
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826-450G STATIC OFF™ ANTISTATIC FOAMING SPRAY
US$11.95
The 826 Static Off™ Antistatic Foaming Spray has non-drip formulation that effectively polishes and eliminates static charges with a single application. The spray is safe on all surfaces and gives a streak-free finish for improved optical clarity and distortion-free reading. The 826 is ideal for use on glass, plexiglass, plastics, and surfaces of production equipment, medical equipment, control panels, computer housing, oscilloscopes and more. It removes dirt, dust, light oils, and fingerprints.
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