Features / Benefits: Meets J-STD-004 and QQ-S-571. No Clean. Standard Flux Core percentage at 2.2%. Melting Point: 183°C / 361°F.
Features / Benefits: Lead free. Complies with RoHS. Exceeds the impurity requirements of J-Std-006. No Clean flux. 21 Gauge, 0.032" diameters. Excellent wettability. Hard non-conductive residues. 1 lb of lead free solder has 27% more length than leaded solder.
Features / Benefits: Lead free. Complies with RoHS. Exceeds the impurity requirements of J-Std-006. No Clean flux. 21 Gauge, 0.032" diameters. Excellent wettability. Hard non-conductive residues.
This solution is a ready to use solution designed for etching printed circuit boards and other metals. Liquid Copper etchant. Ready to use. Can be stored and reused. More aggressive than persulphate aternative. Ready to use solution designed for etching printed circuit boards and other metals.
Has an Oxide-free clean copper Static free bobbins Flux residue that remains on board and does not have to be cleaned.
This has an Oxide-free clean copper Static free bobbins Flux residue that remains on board and does not have to be cleaned.
