The Encapsulating and Potting Epoxy Compounds consist of: Non-conductive, an electrical insulator. Non-porous. Water and chemical resistant. Contains a form of nylon for excellent impact resistance. Provides excellent technology security, extremely. difficult to remove once cured. Excellent machining properties. Suitable for explosion proof components, spark arresting. Less than 0.5% shrinkage during cure. Low toxicity. Easy and simple to mix. Long pot life. Can be cured in one hour at 65oC (150oF). Excellent adhesion to most surfaces.
The Encapsulating and Potting Epoxy Compounds consist of: Non-conductive, an electrical insulator. Non-porous. Water and chemical resistant. Contains a form of nylon for excellent impact resistance. Provides excellent technology security, extremely. Difficult to remove once cured. Excellent machining properties. Suitable for explosion proof components, spark arresting. Less than 0.5% shrinkage during cure. Low toxicity. Easy and simple to mix. Long pot life. Can be cured in one hour at 65oC (150oF). Excellent adhesion to most surfaces.
Reduce or eliminate EM/RFI interference. A general purpose EMI/RFI shielding spray for use on plastic electronics enclosures. Consists of a tough, durable acrylic base pigmented with a high purity. Nickel conductive coating (0.25Ω cm).
Lubricates and improves electrical and thermal connections between sliding surfaces, while providing protection from moisture & corrosion. Excellent for use on switches and EMI shielding applications. Prevents normally closed switches from corroding in place. Reduces make-break arching and pitting of switch contact surfaces. Improves the connection between irregular or pitted contact surfaces. Reduces EMI noise by maintaining a continuous path between conductive surfaces. Thermally stable up to 200°C.
Features / Benefits: RA Flux Core. Meets J-STD-004 / J-STD-006. Non-corrosive and electrically non-conductive flux residue. Standard Flux Core percentage at 2.2%. Melting Point: 183°C / 361°F.
