AD-01 Solderless breadboard with 900 tie points

Price:
US$14.95
AD-01
Delivery within 2-3 weeks
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The AD-01 is a solderless breadboard with 900 tie points.

  • Interconnected rows and blocks
  • Standard DIP sockets (spacing 0,100”)
  • Maximum wire size 30-20 AWG (0.3 - 0.8 mm)

The AD-01 consists of four blocks of six columns of 28 rows, the sockets in each row being interconnected. The blocks are a standard DIP size spacing of 0.100”, although MSI and LSI type chips can be used. At both ends of the blocks, there are two power busses. The ‘Red’ bus is made up of two separate rows of 12 connecting sockets, and the ‘Black’ bus is one row of 24 connecting sockets.

There is an additional matrix of 30 by 6 sockets for non-dip type components. The base has a ‘sticky’ covering to hold the board firm on a workbench or surface.

Dimensions: 117 x 80mm.

Notice for California Residents: Warning symbolWARNING: Cancer and Reproductive Harm - www.P65Warnings.ca.gov