4900P-250G Lead Free No Clean Solder Paste (250 Grams) SAC305
MG Chemicals has developed a unique flux system designed specifically for high temperature lead free alloys. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required, MG 4900P Lead Free Solder paste will provide excellent cost savings.
In addition, MG 4900P Lead Free solder paste exhibits superior joint strength, excellent wettability, and extraordinary print definition and tack life. The post soldering residues of MG 4900P are non-conductive, non-corrosive and highly insulated.
Features & Benefits
- Low residues
- Easily dispensed
- Long tack-time
- Excellent wettability
- Hard non-conductive residues
Storage and Shelf Life
Store refrigerated between 2–10 °C [35–50 °F] to minimize solvent evaporation, flux separation, and
chemical activity. Store syringes in an upright position with tip down to prevent flux separation and air
entrapment.
Bring the paste to room temperature prior to use. To warm the refrigerated paste, let stand 3 hours at
ambient temperature before use. For faster warm up, place the sealed container in a water bath at
ambient temperature for 30 minutes.
Unopened Container 2–10 °C [35–50 °F] 24 months from date of manufacture.
Unopened Container 20–25 °C [68–77 °F] 12 months from date of manufacture.
WARNING
