832HT-3L MG High Temperature Epoxy Encapsulating and Potting Compound

Price:
US$349.35
832HT-3L
Delivery within 2-3 weeks
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The 832HT High Temperature Epoxy Encapsulating and Potting Compound is for encapsulating and potting electronics in high temperature environments, aggressive chemical environments.

Bonds to a wide variety of substrates, including metals, glass, ceramics and many plastics.

Features / Benefits:

  • Extreme physical strength and chemical resistance
  • Suitable for extreme environments, such as submersion in salt water, acids, bases, fuels, and alcohols
  • Protects against strong vibrations, abrasions, and direct physical impact
  • Extremely difficult to remove - grants incredible technology protection
  • Maximum service temperature of 275°C (527°F) 

Typical Applications:

  • Use in electronic assemblies to prevent vibration damage
  • Encapsulate circuits for the purpose of technological protection

Fiche Technique - Data sheet (tds-832ht-2parts-1624779.pdf, 167 Kb) [Download]

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