This comes in a two part dual syringe mixture for electronically insulating epoxy that combines moderate curing rate and high thermal conductivity.
Minimum quantity for "8329TCM-6ML Medium Cure Thermal Conductive Adhesive" is 6.
The Encapsulating and Potting Epoxy Compounds consist of: Non-conductive, an electrical insulator. Non-porous. Water and chemical resistant. Contains a form of nylon for excellent impact resistance. Provides excellent technology security, extremely. difficult to remove once cured. Excellent machining properties. Suitable for explosion proof components, spark arresting. Less than 0.5% shrinkage during cure. Low toxicity. Easy and simple to mix. Long pot life. Can be cured in one hour at 65oC (150oF). Excellent adhesion to most surfaces.
The Encapsulating and Potting Epoxy Compounds consist of: Non-conductive, an electrical insulator. Non-porous. Water and chemical resistant. Contains a form of nylon for excellent impact resistance. Provides excellent technology security, extremely. Difficult to remove once cured. Excellent machining properties. Suitable for explosion proof components, spark arresting. Less than 0.5% shrinkage during cure. Low toxicity. Easy and simple to mix. Long pot life. Can be cured in one hour at 65oC (150oF). Excellent adhesion to most surfaces.
The Encapsulating and Potting Epoxy Compounds consist of: Non-conductive, an electrical insulator. Non-porous. Water and chemical resistant. Contains a form of nylon for excellent impact resistance. Provides excellent technology security, extremely. Difficult to remove once cured. Excellent machining properties. And more.
